Chips

Foreign banks lift targets for Qisafe and Avolens on liquid cooling demand

Driven by rising demand for AI server liquid cooling, Daiwa and Citi have raised price targets for Qisafe and Avolens. The firms noted that thermal management requirements for AI chips are creating significant opportunities for the two cooling giants, highlighting the growing importance of liquid cooling in AI infrastructure.

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  1. Chips

    ByteDance to expand Brazil data center project to boost compute infrastructure

    Bloomberg reported that ByteDance is seeking developers for a second phase of a data center at Pecem Industrial Port in Ceará, Brazil. The new phase will exceed the local $10 billion project under construction, aiming to secure a lead in Latin American compute infrastructure.

    IT之家

  2. Chips

    Argonne National Lab Expands GPU Compute for Autonomous AI Research

    Argonne National Laboratory announced an expansion of its AI inference services, supported by a 100x boost in GPU memory. The new compute capacity will support autonomous laboratory research initiatives, aiming to enhance the efficiency of scientific discovery and simulation while strengthening the facility's computational infrastructure capabilities.

    科技新報

  3. Chips

    Tesla updates AI accelerator roadmap: SI6 achieves 80x HW4 compute

    Tesla unveiled an updated AI accelerator roadmap, with the SI6 inference chip offering 80x the compute of the current HW4. The Dojo D3 training chip will feature a multi-chip design and stacked HBM. Tesla also announced a rebranding of its AI initiatives to 'Super Intelligence' (SI).

    IT之家

  4. Chips

    TSMC Denies Developing 3D DRAM for Nvidia

    TSMC denied reports that it is developing 3D DRAM at Nvidia's request, reiterating its focus on IC foundry services. Although sources claim TSMC has begun planning 3D DRAM production for AI hardware, the company officially denied the story, stating its mission remains centered on logic chips.

    IT之家

  5. Chips

    NVIDIA Funds ASE to Expand CoWoS Advanced Packaging as TSMC Capacity Tightens

    Advanced packaging has become a critical bottleneck for AI chip production. NVIDIA is providing billions of dollars to support ASE's subsidiary Silan Precision to expand CoWoS capacity amid tightening supply from TSMC.

    IT之家

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