Qualcomm launches 150W Cloud AI 100 Ultra accelerator
Qualcomm introduced the Cloud AI 100 Ultra AI accelerator with 150W power consumption. The hardware features 128GB of memory with 548GB/s bandwidth, aimed at enhancing cloud AI computing performance.
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NVIDIA Funds ASE to Expand CoWoS Advanced Packaging as TSMC Capacity Tightens
Advanced packaging has become a critical bottleneck for AI chip production. NVIDIA is providing billions of dollars to support ASE's subsidiary Silan Precision to expand CoWoS capacity amid tightening supply from TSMC.
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Intel rumored to halt Arc B580 for AI pro cards
Industry reports suggest Intel is considering halting production of the Arc B580 gaming GPU to shift capacity to Arc Pro workstation cards. The move reflects the squeeze from AI edge inference hardware, with Intel aiming to capture higher margins in the enterprise market.
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MediaTek AI ASIC revenue hits $2.5B amid investment recovery
MediaTek's Q4 AI ASIC revenue is projected at $2.5 billion. CEO Rick Tsai noted that a transition period remains for investment recovery amid rising AI capex.
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PNNL uses agentic AI to speed up radiation-resistant chip development
The US Department of Energy's Pacific Northwest National Laboratory (PNNL) has implemented agentic AI to accelerate the development of radiation-resistant chips for satellites and nuclear reactors. This initiative aims to mitigate damage from high-energy particles in space and improve hardware reliability.
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TSMC reportedly considering 3D DRAM production for AI hardware
According to The Information, TSMC is planning to produce '3D DRAM' to meet the high-bandwidth needs of AI compute customers like NVIDIA. If materialized, this expansion into the memory market, currently led by Samsung and SK Hynix, would help alleviate supply pressures for AI accelerators.
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