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Oracle Expands Nvidia Deal, Adds Google TPUs

Oracle announced it will expand its partnership with Nvidia, deploying Vera Rubin AI servers on a multi-gigawatt scale. The company is also diversifying its supply chain by integrating Google TPUs and Cerebras chips, using its in-house Acceleron networking chip, with Google TPU services expected to launch in 2027.

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    Altman: DRAM Should Prioritize Data Centers

    OpenAI CEO Sam Altman argued that amid global DRAM shortages, memory should be centralized in data centers rather than distributed to personal PCs. He believes local AI inference leads to resource underutilization and that prioritizing data center capacity is more efficient for meeting compute needs.

    IT之家

  2. Chips

    Murata Invests $630M in MLCC Capacity for AI Servers

    Japan's Murata Manufacturing plans to invest 1 trillion yen (approx. $630 million) over the next five years to expand MLCC production capacity. The investment targets the growing demand for components driven by AI servers.

    科技新報

  3. Chips

    Samsung 2027 HBM Capacity Sold Out

    Samsung Electronics announced that its 2027 HBM capacity is fully sold out and DRAM shortages will persist until 2028. HBM4 revenue tripled quarter-on-quarter, driven by strong demand from AI servers.

    T客邦

  4. Chips

    Nvidia pushes PTFE cabinets, reshaping cross-strait PCB market

    Nvidia is pushing PTFE material into server PCB boards to break through AI transmission limits. This move may reshape the cross-strait PCB factory landscape, impacting the supply chain.

    科技新報

  5. Chips

    MediaTek wins second AI ASIC client for 2028 launch

    MediaTek confirmed a second AI ASIC customer, clarifying it is not a Chinese company, with mass production expected in 2028. Its first customer is Google, and its first data center AI accelerator began shipment in September 2026.

    IT之家

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