China Debuts 12-inch SiC Substrates to Solve AI Chip Cooling
Hunan Titun Future Technology released China's first 12-inch polycrystalline silicon carbide substrates, targeting the cooling bottleneck for AI chips and advanced packaging. The product has passed TSMC certification tests and been sent to Samsung, outperforming international peers in deposition speed and resistivity.
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Murata Invests $630M in MLCC Capacity for AI Servers
Japan's Murata Manufacturing plans to invest 1 trillion yen (approx. $630 million) over the next five years to expand MLCC production capacity. The investment targets the growing demand for components driven by AI servers.
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Samsung 2027 HBM Capacity Sold Out
Samsung Electronics announced that its 2027 HBM capacity is fully sold out and DRAM shortages will persist until 2028. HBM4 revenue tripled quarter-on-quarter, driven by strong demand from AI servers.
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Nvidia pushes PTFE cabinets, reshaping cross-strait PCB market
Nvidia is pushing PTFE material into server PCB boards to break through AI transmission limits. This move may reshape the cross-strait PCB factory landscape, impacting the supply chain.
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MediaTek wins second AI ASIC client for 2028 launch
MediaTek confirmed a second AI ASIC customer, clarifying it is not a Chinese company, with mass production expected in 2028. Its first customer is Google, and its first data center AI accelerator began shipment in September 2026.
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Horizon Robotics' Yu Kai Criticizes Inflated Compute Claims in Auto Chips
Horizon Robotics founder Yu Kai criticized the autonomous driving chip industry for inflating nominal compute figures to 6-7 times their dense values. He noted that labeling practices like those of NVIDIA Orin X have caused confusion, announcing that Horizon will label chips with both 'NV Compute' and 'Equivalent Compute' for clarity. The controversy highlights the lack of transparency in chip marketing definitions.
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