Samsung Plans to Complete 3D Cube-H Advanced Packaging by Early Next Year
Samsung Electronics plans to finish developing the '3D Cube-H' advanced packaging technology by early next year. The technology uses hybrid bonding for high-performance AI chips and could boost its foundry business.
Summarized by AI from one outlet
Source
- IT之家Read original ↗
Latest
- Chips
AI data center demand squeezes Ukraine's optical fiber drone supply chain
Ukraine faces an optical fiber shortage due to massive demand from AI data centers. This has constrained the production of local optical fiber drones, as Ukraine competes with Russia and data centers for China's fiber supply. The situation highlights how infrastructure demand impacts wartime technology supply chains.
- Chips
Moonshot AI Reportedly Leases 32 Nvidia B300 GPU Servers
According to a report by Bloomberg, Chinese AI company Moonshot AI submitted documents to Beijing regulators showing it leased 32 servers equipped with Nvidia B300 GPUs this summer.
- Chips
Huawei Launches Kirin 9050 Series with Logic Folding Tech
Huawei released the Kirin 9050 series, its first chip featuring "logic folding" technology, increasing transistor density by 53.5%. The series integrates the Lingxi CPU, Maliang GPU, and Da Vinci NPU, with the NPU's compute power up 140% and efficiency up 66%, focusing on enhanced on-device AI capabilities.
- Chips
European Chip Giants Bet on Robotics and Physical AI Chips
CEOs of Infineon, STMicroelectronics, and NXP stated that Europe can compete in robotics and physical AI leveraging its automotive and industrial strengths. The companies emphasized the need for stable chips in real-world environments and mentioned humanoid robot deployment plans.
- Chips
Interviews discuss AI compute power bottlenecks and cloud-edge synergy
Founders of Visionbay.ai and Kneron discussed AI infrastructure. They noted that industry bottlenecks have shifted from GPU scarcity to power constraints, analyzing the division of labor between AI data centers and edge chips.
All news → · All rights belong to the original creators